Memory chip

Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
50544 PCS
En stock
Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
79350 PCS
En stock
Numéro d'article
GigaDevice (GigaDevice Innovation)
Fabricants
Description
95778 PCS
En stock
Numéro d'article
ISSI (American core into)
Fabricants
Description
53696 PCS
En stock
Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
88712 PCS
En stock
Numéro d'article
CYPRESS (Cypress)
Fabricants
Description
65059 PCS
En stock
Numéro d'article
ST (STMicroelectronics)
Fabricants
Description
87672 PCS
En stock
Numéro d'article
ICMAX (Hong Wang)
Fabricants
Description
62437 PCS
En stock
Numéro d'article
FMD (Hui Mang Micro)
Fabricants
Description
79506 PCS
En stock
Numéro d'article
WINBOND (Winbond)
Fabricants
Description
83325 PCS
En stock
Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
95844 PCS
En stock
Numéro d'article
CYPRESS (Cypress)
Fabricants
Description
53863 PCS
En stock
Numéro d'article
micron
Fabricants
1-Gbit(128M x 8bit), parallel interface, working voltage: 2.7V to 3.6V
Description
87415 PCS
En stock
Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
82927 PCS
En stock
Numéro d'article
HGSEMI (Huaguan)
Fabricants
2.7-5.0V
Description
82037 PCS
En stock
Numéro d'article
ST (STMicroelectronics)
Fabricants
Description
97078 PCS
En stock
Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
54788 PCS
En stock
Numéro d'article
MICROCHIP (US Microchip)
Fabricants
Description
69188 PCS
En stock
Numéro d'article
CYPRESS (Cypress)
Fabricants
Description
83439 PCS
En stock
Numéro d'article
CS (Creation)
Fabricants
SD NAND second generation, driver-free, standard SDIO interface, compatible with SPI/SD/eMMC interface, compatible with major MCU platforms; built-in EDC/ECC, bad block management, garbage collection algorithm; can be machine-mounted, lock wafer and controller , High consistency; built-in SLC wafer, 10W erasing and writing life, passed 10,000 random power-off tests, and supports industrial-grade temperature -40°~+85°. CS (Creation) SD NAND is also called by many developers and friends: SMD TF card, SMD SD card, SMD card, soldered SD card, soldered TF card, industrial-grade TF card, industrial-grade SD card, embedded SD card, etc. It mainly solves the problem that the main control (such as STM32 series MCU MCU) needs to manage NAND FLASH by itself when using SLC NAND FLASH, SPI NAND FLASH, eMMC, etc. CS (Genesis) SD NAND can be used without drivers (so it is also called no need to write drivers NAND Flash). Compared with eMMC, CS (Genesis) SD NAND has fewer pins (convenient for soldering); smaller capacity (can help customers reduce costs); longer erasing life; smaller size (occupies only 1/3 of eMMC PCB area) ); save the number of PCB board layers (2-layer board can be used)
Description
66033 PCS
En stock