XC6SLX25-3FG484C

Product Overview

Category

XC6SLX25-3FG484C belongs to the category of Field Programmable Gate Arrays (FPGAs).

Use

This product is commonly used in digital circuit design and implementation. FPGAs provide a flexible and customizable solution for various applications, including telecommunications, automotive, aerospace, and consumer electronics.

Characteristics

• High-performance programmable logic device
• Low power consumption
• Large number of configurable logic blocks
• Integrated memory blocks
• Flexible I/O options
• High-speed serial transceivers
• On-chip analog-to-digital converters (ADCs)
• Support for various communication protocols

Package

XC6SLX25-3FG484C is available in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of XC6SLX25-3FG484C lies in its ability to provide a reconfigurable hardware platform that allows users to implement complex digital systems with high performance and flexibility.

Packaging/Quantity

XC6SLX25-3FG484C is typically sold individually or in reels, depending on the manufacturer's packaging specifications.

Specifications

• Logic Cells: 24,576
• Flip-Flops: 49,152
• Block RAM: 1,080 Kb
• DSP Slices: 48
• Maximum Frequency: 550 MHz
• Operating Voltage: 1.2V
• I/O Voltage: 1.8V
• Operating Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The detailed pin configuration of XC6SLX25-3FG484C can be found in the product datasheet provided by the manufacturer.

Functional Features

• Configurable logic blocks allow for the implementation of custom digital circuits.
• Integrated memory blocks provide on-chip storage for data processing.
• High-speed serial transceivers enable communication with external devices at high data rates.
• On-chip ADCs facilitate analog signal processing.
• Support for various communication protocols allows for seamless integration into different systems.

Advantages and Disadvantages

Advantages

• Flexibility: FPGAs can be reprogrammed to adapt to changing requirements.
• High Performance: XC6SLX25-3FG484C offers a large number of logic cells and flip-flops, enabling the implementation of complex designs.
• Low Power Consumption: The device is designed to operate efficiently, minimizing power consumption.
• Integration: On-chip features such as memory blocks and ADCs reduce the need for external components.

Disadvantages

• Complexity: Designing and programming FPGAs requires specialized knowledge and expertise.
• Cost: FPGAs can be more expensive compared to other programmable logic devices.
• Limited Resources: The available resources on the FPGA may restrict the size and complexity of the design that can be implemented.

Working Principles

XC6SLX25-3FG484C operates based on the principles of reconfigurable hardware. The device consists of configurable logic blocks, memory blocks, I/O interfaces, and other supporting components. Users program the FPGA using Hardware Description Languages (HDLs) such as VHDL or Verilog. The programmed configuration is then loaded onto the FPGA, allowing it to function as a custom digital circuit.

Detailed Application Field Plans

XC6SLX25-3FG484C finds applications in various fields, including:

1. Telecommunications: Used in base stations, routers, and network switches for high-speed data processing and protocol handling.
2. Automotive: Employed in advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs) for real-time processing and control.
3. Aerospace: Utilized in satellite communication systems, avionics, and radar systems for signal processing and data handling.
4. Consumer Electronics: Integrated into high-definition televisions, gaming consoles, and audio/video processing devices for multimedia processing and connectivity.

Detailed and Complete Alternative Models

1. XC6SLX25-2FG484C: Similar to XC6SLX25-3FG484C but operates at a lower maximum frequency.
2. XC6SLX25T-3FG484C: Offers additional on-chip transceivers for high-speed serial communication.
3. XC6SLX25-3CSG324C: Available in a different package with a smaller footprint.

These alternative models provide similar functionality with slight variations in specifications and packaging options.

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