Xilinx Inc.
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XC3S700A-4FGG484C
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XC3S700A-4FGG484C

Product Overview

Category

XC3S700A-4FGG484C belongs to the category of Field-Programmable Gate Arrays (FPGAs).

Use

This product is primarily used in digital logic circuits for various applications such as telecommunications, automotive, aerospace, and consumer electronics.

Characteristics

  • High-performance FPGA with advanced features
  • Flexible and reconfigurable design
  • Low power consumption
  • High-speed data processing capabilities

Package

XC3S700A-4FGG484C is available in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of XC3S700A-4FGG484C lies in its ability to provide a customizable hardware solution for complex digital systems.

Packaging/Quantity

This product is typically packaged individually and is available in various quantities depending on the manufacturer's specifications.

Specifications

  • Device Type: FPGA
  • Logic Cells: 700,000
  • Operating Voltage: 1.2V
  • Maximum Frequency: 400 MHz
  • I/O Pins: 484
  • Memory Blocks: 2,160
  • Embedded Multiplier Blocks: 360
  • Package Type: FBGA
  • Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The detailed pin configuration of XC3S700A-4FGG484C can be found in the product datasheet provided by the manufacturer. It includes information about the function and connectivity of each pin.

Functional Features

  • Configurable logic blocks for implementing custom digital circuits
  • Built-in memory blocks for storing data
  • Dedicated input/output pins for interfacing with external devices
  • Clock management resources for precise timing control
  • Embedded multipliers for efficient arithmetic operations
  • Support for various communication protocols

Advantages and Disadvantages

Advantages

  • Flexibility in design and reconfiguration
  • High-performance capabilities
  • Low power consumption compared to traditional ASICs
  • Shorter development time due to programmability

Disadvantages

  • Higher cost compared to fixed-function integrated circuits
  • Limited resources for complex designs
  • Steeper learning curve for programming and utilization

Working Principles

XC3S700A-4FGG484C operates based on the principles of FPGA technology. It consists of configurable logic blocks interconnected through programmable routing resources. The device can be programmed using Hardware Description Languages (HDL) such as VHDL or Verilog, which define the desired digital circuit functionality. Once programmed, the FPGA executes the specified logic operations.

Detailed Application Field Plans

XC3S700A-4FGG484C finds applications in various fields, including:

  1. Telecommunications: Used in network routers, switches, and base stations for high-speed data processing.
  2. Automotive: Employed in automotive electronics for functions like engine control, driver assistance systems, and infotainment.
  3. Aerospace: Utilized in satellite communication systems, avionics, and onboard data processing.
  4. Consumer Electronics: Integrated into devices like high-definition televisions, gaming consoles, and audio/video equipment for enhanced performance.

Detailed and Complete Alternative Models

Some alternative models to XC3S700A-4FGG484C include:

  1. XC7A100T-2FGG484C
  2. XC6SLX150-2FGG484C
  3. XC5VLX110T-2FFG1136C
  4. XC2S200E-6FGG256C

These models offer different specifications and features, allowing users to choose the most suitable FPGA for their specific requirements.

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Énumérez 10 questions et réponses courantes liées à l'application de XC3S700A-4FGG484C dans les solutions techniques

Sure! Here are 10 common questions and answers related to the application of XC3S700A-4FGG484C in technical solutions:

  1. Q: What is XC3S700A-4FGG484C? A: XC3S700A-4FGG484C is a field-programmable gate array (FPGA) from Xilinx, which offers high-performance digital logic capabilities.

  2. Q: What are the key features of XC3S700A-4FGG484C? A: Some key features include 700,000 system gates, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, 4-input look-up tables (LUTs), and built-in multipliers.

  3. Q: What are the typical applications of XC3S700A-4FGG484C? A: XC3S700A-4FGG484C is commonly used in various technical solutions such as digital signal processing, embedded systems, telecommunications, aerospace, and industrial automation.

  4. Q: How can I program XC3S700A-4FGG484C? A: XC3S700A-4FGG484C can be programmed using Xilinx's Vivado Design Suite or ISE Design Suite software tools.

  5. Q: What voltage levels does XC3S700A-4FGG484C support? A: XC3S700A-4FGG484C supports both 3.3V and 1.8V voltage levels for different I/O standards.

  6. Q: Can XC3S700A-4FGG484C interface with other devices? A: Yes, XC3S700A-4FGG484C supports various communication protocols such as SPI, I2C, UART, and Ethernet, allowing it to interface with other devices.

  7. Q: What is the maximum operating frequency of XC3S700A-4FGG484C? A: The maximum operating frequency of XC3S700A-4FGG484C depends on the design and implementation, but it can typically reach frequencies in the range of hundreds of megahertz (MHz) to a few gigahertz (GHz).

  8. Q: Can XC3S700A-4FGG484C be used for real-time applications? A: Yes, XC3S700A-4FGG484C can be used for real-time applications as it offers high-speed processing capabilities and supports various timing constraints.

  9. Q: Is XC3S700A-4FGG484C suitable for low-power applications? A: XC3S700A-4FGG484C is not specifically designed for low-power applications, but it does offer power-saving features such as clock gating and dynamic power management options.

  10. Q: Are there any development boards available for XC3S700A-4FGG484C? A: Yes, Xilinx provides development boards like the Spartan-3A Evaluation Kit that can be used for prototyping and testing designs based on XC3S700A-4FGG484C.

Please note that these answers are general and may vary depending on specific requirements and use cases.