SI5340B-B-GM belongs to the category of integrated circuits (ICs).
SI5340B-B-GM is commonly used in electronic devices for clock generation and distribution.
SI5340B-B-GM is available in a compact surface-mount package.
The essence of SI5340B-B-GM lies in its ability to generate and distribute accurate clock signals in various electronic systems.
SI5340B-B-GM is typically packaged in reels or trays, with a quantity of 250 units per reel/tray.
For detailed and complete pin configuration information, please refer to the datasheet provided by the manufacturer.
SI5340B-B-GM offers the following functional characteristics:
SI5340B-B-GM is suitable for use in a wide range of electronic devices that require accurate clock generation and distribution, such as communication systems, data centers, industrial automation, and test equipment.
SI5340B-B-GM utilizes a combination of PLLs, frequency dividers, and programmable logic to generate and distribute clock signals. The device can be programmed to generate clocks with precise frequencies and formats according to the requirements of the system.
Q: Can SI5340B-B-GM operate at temperatures below -40°C? A: Yes, SI5340B-B-GM is designed to operate within a temperature range of -40°C to +85°C.
Q: How many outputs does SI5340B-B-GM have? A: SI5340B-B-GM has four outputs.
Q: Can I program the output formats of SI5340B-B-GM? A: Yes, SI5340B-B-GM supports programmable output formats such as LVCMOS and LVDS.
Q: What is the frequency range of SI5340B-B-GM? A: SI5340B-B-GM can generate frequencies ranging from 1 Hz to 2.67 GHz.
Q: Are there any alternative models with higher performance? A: Yes, alternative models such as SI5341A-A-GM and SI5342C-C-GM offer additional features and improved performance compared to SI5340B-B-GM.
This encyclopedia entry provides an overview of SI5340B-B-GM, including its category, use, characteristics, package, specifications, pin configuration, functional characteristics, advantages and disadvantages, applicable range of products, working principles, detailed application field plans, alternative models, and common technical questions and answers.