M2S010-1FGG484

Product Overview

Category

M2S010-1FGG484 belongs to the category of Field Programmable Gate Arrays (FPGAs).

Use

This product is primarily used in digital logic circuits for various applications such as telecommunications, automotive, industrial automation, and consumer electronics.

Characteristics

• High-performance programmable logic device
• Offers flexibility and reconfigurability
• Provides high-speed data processing capabilities
• Supports complex algorithms and computations
• Low power consumption
• Compact size

Package

M2S010-1FGG484 comes in a compact package that ensures easy integration into electronic systems. The package is designed to provide protection against environmental factors such as moisture, dust, and electrostatic discharge.

Essence

The essence of M2S010-1FGG484 lies in its ability to provide a customizable hardware solution for various digital applications. It allows users to implement their desired functionality by programming the FPGA, eliminating the need for dedicated hardware components.

Packaging/Quantity

Each M2S010-1FGG484 unit is packaged individually to ensure proper handling and protection during transportation. The quantity per package may vary depending on the manufacturer's specifications.

Specifications

• Model: M2S010-1FGG484
• Logic Elements: 10,000
• Embedded Memory: 500 Kbits
• Maximum Frequency: 400 MHz
• I/O Pins: 484
• Operating Voltage: 1.2V
• Package Type: Fine-Pitch Ball Grid Array (FBGA)
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The pin configuration of M2S010-1FGG484 is as follows:

[Insert detailed pin configuration diagram here]

Functional Features

• Configurable logic blocks for implementing custom digital circuits
• Dedicated memory blocks for storing data
• Programmable interconnects for establishing connections between different components
• Clock management resources for precise timing control
• Built-in I/O interfaces for seamless integration with external devices

Advantages and Disadvantages

Advantages

• Flexibility: Allows users to adapt the FPGA to their specific requirements.
• Reconfigurability: Can be reprogrammed multiple times, enabling design changes without hardware modifications.
• High Performance: Capable of handling complex algorithms and computations efficiently.
• Low Power Consumption: Helps in reducing overall power consumption in electronic systems.
• Compact Size: Occupies less space compared to traditional dedicated hardware solutions.

Disadvantages

• Complexity: Requires expertise in digital circuit design and programming.
• Cost: FPGAs can be more expensive than off-the-shelf integrated circuits for certain applications.
• Limited Resources: The number of logic elements and memory blocks may restrict the complexity of designs that can be implemented.

Working Principles

M2S010-1FGG484 operates based on the principles of reconfigurable computing. It consists of an array of configurable logic blocks interconnected through programmable routing resources. These logic blocks can be programmed to implement desired functionality by configuring the interconnections and behavior of individual components within the FPGA.

Detailed Application Field Plans

M2S010-1FGG484 finds applications in various fields, including:

1. Telecommunications: Used in base stations, network routers, and communication protocols.
2. Automotive: Employed in advanced driver-assistance systems (ADAS), engine control units (ECUs), and infotainment systems.
3. Industrial Automation: Utilized in programmable logic controllers (PLCs), robotics, and process control systems.
4. Consumer Electronics: Integrated into smart TVs, gaming consoles, and wearable devices.

Detailed and Complete Alternative Models

1. Model: M2S050-1FGG484

   • Logic Elements: 50,000
   • Embedded Memory: 2 Mbits
   • Maximum Frequency: 500 MHz
   • I/O Pins: 484
   • Operating Voltage: 1.2V
   • Package Type: Fine-Pitch Ball Grid Array (FBGA)
   • Temperature Range: -40°C to +85°C

2. Model: M2S200-1FGG484

   • Logic Elements: 200,000
   • Embedded Memory: 8 Mbits
   • Maximum Frequency: 600 MHz
   • I/O Pins: 484
   • Operating Voltage: 1.2V
   • Package Type: Fine-Pitch Ball Grid Array (FBGA)
   • Temperature Range: -40°C to +85°C

3. Model: M2S500-1FGG484

   • Logic Elements: 500,000
   • Embedded Memory: 16 Mbits
   • Maximum Frequency: 700 MHz
   • I/O Pins: 484
   • Operating Voltage: 1