MT47H256M4CF-3 IT:H

Product Overview

Category

The MT47H256M4CF-3 IT:H belongs to the category of semiconductor memory products.

Use

This product is primarily used for data storage and retrieval in electronic devices such as computers, smartphones, and tablets.

Characteristics

• High-speed operation
• Large storage capacity
• Low power consumption
• Reliable performance

Package

The MT47H256M4CF-3 IT:H is packaged in a compact and durable form factor, suitable for integration into various electronic devices.

Essence

The essence of this product lies in its ability to store and retrieve digital information quickly and efficiently.

Packaging/Quantity

The MT47H256M4CF-3 IT:H is typically packaged in trays or reels, with quantities varying depending on customer requirements.

Specifications

• Memory Type: DDR3 SDRAM
• Capacity: 256 Megabits (32 Megabytes)
• Organization: 4 banks x 4,096 rows x 2,048 columns
• Operating Voltage: 1.5V
• Speed Grade: -3 (operating frequency up to 1333 MHz)
• Interface: Double Data Rate (DDR)
• Pin Count: 96 pins
• Package Type: FBGA (Fine-Pitch Ball Grid Array)

Detailed Pin Configuration

The MT47H256M4CF-3 IT:H has a total of 96 pins, each serving a specific function. The pin configuration is as follows:

• Pins 1-48: Address Inputs
• Pins 49-64: Data Inputs/Outputs
• Pins 65-72: Control Inputs
• Pins 73-80: Clock Inputs
• Pins 81-88: Power Supply and Ground
• Pins 89-96: Reserved

Functional Features

• High-speed data transfer
• Burst mode operation for efficient data access
• Auto-refresh and self-refresh modes for power saving
• On-die termination (ODT) for improved signal integrity

Advantages and Disadvantages

Advantages

• Fast data transfer speeds enhance overall system performance
• Large storage capacity allows for extensive data storage
• Low power consumption prolongs battery life in portable devices
• Reliable performance ensures data integrity

Disadvantages

• Relatively higher cost compared to other memory technologies
• Limited compatibility with older device architectures

Working Principles

The MT47H256M4CF-3 IT:H operates based on the principles of DDR3 SDRAM technology. It utilizes a synchronous interface and employs advanced circuitry to enable high-speed data transfer between the memory module and the host device.

Detailed Application Field Plans

The MT47H256M4CF-3 IT:H finds application in various electronic devices, including but not limited to: - Personal computers - Laptops and notebooks - Servers - Workstations - Mobile phones - Tablets - Gaming consoles

Detailed and Complete Alternative Models

1. MT47H128M8BT-3 IT:H

   • Memory Type: DDR3 SDRAM
   • Capacity: 128 Megabits (16 Megabytes)
   • Organization: 8 banks x 2,048 rows x 1,024 columns
   • Operating Voltage: 1.5V
   • Speed Grade: -3 (operating frequency up to 1333 MHz)
   • Interface: DDR
   • Pin Count: 78 pins
   • Package Type: FBGA

2. MT47H512M16HR-25E:H

   • Memory Type: DDR3 SDRAM
   • Capacity: 512 Megabits (64 Megabytes)
   • Organization: 16 banks x 8,192 rows x 4,096 columns
   • Operating Voltage: 1.35V
   • Speed Grade: -25E (operating frequency up to 1866 MHz)
   • Interface: DDR3L
   • Pin Count: 96 pins
   • Package Type: FBGA

3. MT47H1024M8HQ-25E:H

   • Memory Type: DDR3 SDRAM
   • Capacity: 1024 Megabits (128 Megabytes)
   • Organization: 8 banks x 4,096 rows x 2,048 columns
   • Operating Voltage: 1.35V
   • Speed Grade: -25E (operating frequency up to 1866 MHz)
   • Interface: DDR3L
   • Pin Count: 78 pins
   • Package Type: FBGA

These alternative models offer different capacities, operating voltages, and speed grades to cater to diverse application requirements.

*Note: The above specifications are subject to change. Please refer to the manufacturer's datasheet for the most up-to