The AS4C64M16D2B-25BCNTR belongs to the category of dynamic random-access memory (DRAM) chips.
It is used as a primary storage component in various electronic devices such as computers, smartphones, and networking equipment.
The AS4C64M16D2B-25BCNTR is typically available in surface-mount packages.
This DRAM chip is essential for providing temporary data storage and quick access to information for electronic devices.
The AS4C64M16D2B-25BCNTR is commonly packaged in reels and is available in varying quantities based on customer requirements.
The detailed pin configuration for the AS4C64M16D2B-25BCNTR can be found in the product datasheet provided by the manufacturer.
The AS4C64M16D2B-25BCNTR operates based on the principles of charge storage within capacitors, which are accessed through a matrix of address lines to read and write data.
The AS4C64M16D2B-25BCNTR is widely used in applications such as: - Computer systems - Mobile devices - Networking equipment - Industrial control systems
In conclusion, the AS4C64M16D2B-25BCNTR is a vital component in electronic devices, offering high-speed operation, low power consumption, and compact packaging. Its application spans across various industries, and it has alternative models catering to different memory size requirements.
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What is the AS4C64M16D2B-25BCNTR?
What are the key features of the AS4C64M16D2B-25BCNTR?
In what applications can the AS4C64M16D2B-25BCNTR be used?
What is the maximum operating temperature range for the AS4C64M16D2B-25BCNTR?
Does the AS4C64M16D2B-25BCNTR support industrial-grade applications?
What is the typical power consumption of the AS4C64M16D2B-25BCNTR?
Can the AS4C64M16D2B-25BCNTR be used in automotive electronics?
Is the AS4C64M16D2B-25BCNTR compatible with standard DDR2 interfaces?
What are the recommended PCB layout guidelines for the AS4C64M16D2B-25BCNTR?
Are there any specific design considerations when using the AS4C64M16D2B-25BCNTR in high-speed applications?